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rev. a wideband, 40 db isolation at 1 ghz, cmos 1.65 v to 2.75 v, spst switches ADG901/adg902 information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781/329-4700 www.analog.com fax: 781/326-8703 ?2004 analog devices, inc. all rights reserved. functional block diagrams rf2 ctrl ADG901 rf1 50 50 rf2 ctrl adg902 rf1 features wideband switch: ? db @ 4.5 ghz absorptive/reflective switches high off isolation (40 db @ 1 ghz) low insertion loss (0.8 db @1 ghz) single 1.65 v to 2.75 v power supply cmos/lvttl control logic 8-lead msop and tiny 3 mm 3 mm lfcsp packages low power consumption (<1 a) applications wireless communications general-purpose rf switching dual-band applications high speed filter selection digital transceiver front end switch if switching tuner modules antenna diversity switching frequency (hz) 10k 100k 1m 10m 100m 1g 10g ?100 ?90 ?70 ?60 ?50 ?40 ?30 ?80 ? 20 ?10 0 isolation (db) t a = 25 c v dd = 2.5 v v dd = 1.8 v figure 1. off isolation vs. frequency frequency (hz) 10k 100k 1m 10m 100m 1g 10g ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0.8 ?0.6 ?0.4 insertion loss (db) v dd = 2.5v t a = 25 c figure 2. insertion loss vs. frequency general description the ADG901/adg902 are wideband switches that use a cmos process to provide high isolation and low insertion loss to 1 ghz. the ADG901 is an absorptive (matched) switch with 50 ? terminated shunt legs, while the adg902 is a reflective switch. these devices are designed such that the isolation is high over the dc to 1 ghz frequency range. they have on-board cmos control logic, thus eliminating the need for external controlling circuitry. the control inputs are both cmos and lvttl compatible. the low power consumption of these cmos devices m akes them ideally suited to wireless applica- tions and general-purpose high frequency switching. product highlights 1. C 40 db off isolation @ 1 ghz 2. 0.8 db insertion loss @ 1 ghz 3. tiny 8-lead msop/lfcsp packages
rev. a e2e ADG901/adg902especifications 1 b version parameter symbol conditions min typ 2 max unit ac electrical characteristics operating frequency 3 dc 2.5 ghz ? 3 db frequency 4 4.5 ghz input power 4 0 v dc bias 7 dbm +0.5 v dc bias 16 dbm insertion loss s 21 , s 12 dc to 100 mhz; v dd = 2.5 v 10% 0.4 0.7 db 500 mhz; v dd = 2.5 v 10% 0.5 0.8 db 1000 mhz; v dd = 2.5 v 10% 0.8 1.25 db isolation ? rf1 to rf2 s 21 , s 12 100 mhz 60 61 db (cp package) 500 mhz 43 45 db 1000 mhz 34 40 db isolation ? rf1 to rf2 s 21 , s 12 100 mhz 51 60 db (rm package) 500 mhz 37.5 47 db 1000 mhz 31 37 db return loss (on channel) 4 s 11 , s 22 dc to 100 mhz 20 28 db 500 mhz 23 29 db 1000 mhz 25 28 db return loss (off channel) 4 s 11 , s 22 dc to 100 mhz 18 23 db 500 mhz 17 21 db 1000 mhz 15 19 db on switching time 4 t on 50% ctrl to 90% rf 3.6 6 ns off switching time 4 t off 50% ctrl to 10% rf 5.8 9.5 ns rise time 4 t rise 10% to 90% rf 3.1 5.5 ns fall time 4 t fall 90% to 10% rf 6.0 8.5 ns 1 db compression 4 p ? 1 db 1000 mhz 17 dbm third order intermodulation intercept ip 3 900 mhz/901 mhz, 4 dbm 30 36 dbm video feedthrough 5 2.5 mv p-p dc electrical characteristics input high voltage v inh v dd = 2.25 v to 2.75 v 1.7 v v inh v dd = 1.65 v to 1.95 v 0.65 v cc v input low voltage v inl v dd = 2.25 v to 2.75 v 0.7 v v inl v dd = 1.65 v to 1.95 v 0.35 v cc v input leakage current i i 0 v in 2.75 v 0.1 1 a capacitance 4 rf1/rf2, rf port on capacitance c rf on f = 1 mhz 1.2 pf ctrl input capacitance c ctrl f = 1 mhz 2.1 pf power requirements v dd 1.65 2.75 v quiescent power supply current i dd digital inputs = 0 v or v dd 0.1 1 a notes 1 temperature range b version: ? 40 c to +85 c. 2 typical values are at v dd = 2.5 v and 25 c, unless otherwise stated. 3 point at which insertion loss degrades by 1 db. 4 guaranteed by design, not subject to production test. 5 the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 mhz bandwidth. specifications subject to change without notice. (v dd = 1.65 v to 2.75 v, gnd = 0 v, input power = 0 dbm, all specifications t min to t max , unless otherwise noted.)
rev. a ADG901/adg902 e3e absolute maximum ratings 1 (t a = 25 c, unless otherwise noted.) v dd to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . ? 0.5 v to +4 v inputs to gnd . . . . . . . . . . . . . . . . . . ? 0.5 v to v dd + 0.3 v 2 continuous current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 ma input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dbm operating temperature range industrial (b version) . . . . . . . . . . . . . . . . ? 40 c to +85 c storage temperature range . . . . . . . . . . . . ? 65 c to +150 c junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 c msop package ja thermal impedance . . . . . . . . . . . . . . . . . . . . . 206 c/w lfcsp package ja thermal impedance (2-layer board) . . . . . . . . . . 84 c/w ja thermal impedance (4-layer board) . . . . . . . . . . 48 c/w lead temperature, soldering (10 sec) . . . . . . . . . . . . . 300 c ir reflow, peak temperature (<20 sec) . . . . . . . . . . . . 235 c esd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kv notes 1 stresses above those listed under absolute maximum ratings may cause perma- nent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. only one absolute maximum rating may be applied at any one time. 2 rf1/2 off port inputs to ground ................................... ? 0.5 v to v dd ? 0.5 v caution esd (electrostatic discharge) sensitive device. electrostatic charges as high as 4000 v readily accumulate on the human body and test equipment and can discharge without detection. although the ADG901/adg902 features proprietary esd protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. therefore, proper esd precautions are recommended to avoid performance degradation or loss of functionality. ordering guide model temperature range package description package option branding ADG901brm ? 40 c to +85 cm ini small outline package (msop) rm-8 w6b ADG901brm-500rl7 ? 40 c to +85 cm ini small outline package (msop) rm-8 w6b ADG901brm-reel7 ? 40 c to +85 cm ini small outline package (msop) rm-8 w6b ADG901bcp-500rl7 ? 40 c to +85 cl ead frame chip scale package (lfcsp) cp-8 w6b ADG901bcp-reel7 ? 40 c to +85 cl ead frame chip scale package (lfcsp) cp-8 w6b adg902brm ? 40 c to +85 cm ini small outline package (msop) rm-8 w7b adg902brm-500rl7 ? 40 c to +85 cm ini small outline package (msop) rm-8 w7b adg902brm-reel7 ? 40 c to +85 cl ead frame chip scale package (lfcsp) rm-8 w7b adg902bcp-500rl7 ? 40 c to +85 cl ead frame chip scale package (lfcsp) cp-8 w7b adg902bcp-reel7 ? 40 c to +85 cl ead frame chip scale package (lfcsp) cp-8 w7b eval-ADG901eb evaluation board eval-adg902eb evaluation board table i. truth table ctrl signal path 0 rf1 isolated from rf2 1 rf1 to rf2 pin configuration 8-lead msop (rm-8) 8-lead 3 mm 3 mm lfcsp (cp-8) top view (not to scale) 1 v dd ctrl gnd rf1 ADG901/ adg902 gnd gnd rf2 gnd 2 3 4 8 7 6 5 pin function descriptions pin no. mnemonic function 1v dd power supply input. these parts can be operated from 1.65 v to 2.75 v; v dd should be decoupled to gnd. 2 ctrl cmos or ttl logic level. 0 ? ?
rev. a e4e ADG901/adg902 terminology parameter description v dd most positive power supply potential. i dd positive supply current. gnd ground (0 v) reference. ctrl logic control input. v inl maximum input voltage for logic 0. v inh minimum input voltage for logic 1. i inl (i inh ) input current of the digital input. c in digital input capacitance. t on delay between applying the digital control input and the output switching on. t off delay between applying the digital control input and the output switching off. t rise rise time. time for the rf signal to rise from 10% to 90% of the on level. t fall fall time. time for the rf signal to fall from 90% to 10% of the on level. off isolation the attenuation between input and output ports of the switch when the switch control voltage is in the off condition. insertion loss the attenuation between input and output ports of the switch when the switch control voltage is in the on condition. p ? 1 db 1 db compression point. the rf input power level at which the switch insertion loss increases by 1 db over its low level value. it is a measure of how much power the on switch can handle before the insertion loss increases by 1 db. ip 3 third order intermodulation intercept. this is a measure of the power in false tones that occur when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. return loss the amount of reflected power relative to the incident power at a port. large return loss indicates good matching. by measuring return loss the vswr can be calculated from conversion charts. vswr (voltage standing wave ratio) indicates degree of matching present at a switch rf port. video feedthrough spurious signals present at the rf ports of the switch when the control voltage is switched from high to low or low to high without an rf signal present.
rev. a t ypical performance characteristicseADG901/adg902 e5e ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0.8 ?0.6 ?0.4 frequency (hz) 10k 100k 1m 10m 100m 1g 10g insertion loss (db) v dd = 2.25v v dd = 2.75v t a = 25 c v dd = 2.5v tpc 1. insertion loss vs. frequency o ver supplies (s12 and s21) +85 c v dd = 2.5v ?40 c +25 c ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0.8 ?0.6 ?0.4 insertion loss (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g tpc 4. insertion loss vs. frequency over temperature (s12 and s21) t a = 25 c v dd = 2.5v off switch on switch ?35 ?30 ?25 ?20 ?15 ? 10 ?5 0 return loss (db) frequency (hz) 10k 100k 1m 10m 100m 1g 10g tpc 7. return loss vs. frequency (s11) ?0.95 ?0.90 ?0.85 ?0.75 ?0.70 ?0.65 ?0.60 ?0.55 ?0.80 ?1.00 ? 0.50 ?0.45 ?0.40 frequency (hz) 10k 100k 1m 10m 100m 1g 10g insertion loss (db) t a = 25 c v dd = 2.75v v dd = 2.5v v dd = 2.25v tpc 2. insertion loss vs. frequency o ver supplies (s12 and s21) (zoomed tpc 1 plot) v dd = 2.5v v dd = 1.8v t a = 25 c ?90 ?70 ?60 ?50 ?40 ?30 ?80 ? 20 ?10 ?5 ?15 ?25 ?35 ?45 ?55 ?65 ?75 ?85 ?95 0 isolation (db) ?100 frequency (hz) 10k 100k 1m 10m 100m 1g 10g tpc 5. off isolation vs. frequency over supplies (s12 and s21) ch1 = ctrl = 1v/div t rise = 2.8ns ch2 = rfx = 100mv/div t fall = 5.1ns ch2 ch1 tpc 8. switch timing ?2.8 ?2.6 ?2.4 ?2.2 ?1.8 ?1.6 ?1.4 ?1.2 ?1.0 ?2.0 ?3.0 ? 0.8 ?0.6 ?0.4 insertion loss (db) v dd = 1.65v t a = 25 c v dd = 1.95v v dd = 1.8v frequency (hz) 10k 100k 1m 10m 100m 1g 10g tpc 3. insertion loss vs. frequency o ver supplies (s12 and s21) v dd = 2.5v +85 c +25 c ?40 c ?70 ?60 ?50 ?40 ?30 ?80 ? 20 ?10 ?5 ?15 ?25 ?35 ?45 ?55 ?65 ?75 ?85 0 isolation (db) ?90 frequency (hz) 10k 100k 1m 10m 100m 1g 10g tpc 6. off isolation vs. frequency over temperature (s12 and s21) ch1 500mv ch2 1mv 10.0ns ctrl rfx ch2 pk-pk 2.016mv tpc 9. video feedthrough
rev. a e6e ADG901/adg902 40 35 250 350 450 550 frequency (mhz) 650 750 850 30 ip 3 (dbm) 25 20 15 10 5 0 v dd = 2.5v t a = 25 c tpc 10. ip 3 vs. frequency 20 0 250 500 750 1000 1250 frequency (mhz) 1500 p ?1db (dbm) 2 4 6 8 10 12 14 16 18 0 v dd = 2.5v t a = 25 c tpc 11. p e1db vs. frequency
rev. a ADG901/adg902 e7e t est circuits * v dd v dd 0.1 f v s ctrl rf2 rf1 gnd r l 50 v out v ctrl 50% 50% v out t on t off 90% 10% test circuit 1. switching timing: t on , t off v dd v dd 0.1 f v s ctrl rf2 rf1 gnd r l 50 v out v ctrl 50% 50% v out t rise t fall 90% 10% 90% 10% test circuit 2. switch timing: t rise , t fall off isolation = 20 log out v s v v s 50 network analyzer v out r l 50 0.1 f v ctrl gnd rf2 ctrl ADG901 rf1 50 50 v dd v dd test circuit 3. off isolation insertion loss = 20 log out v s v v s 50 network analyzer v out r l 50 0.1 f v dd v ctrl gnd rf2 ctrl ADG901 rf1 50 50 v dd test circuit 4. insertion loss oscilloscope 0.1 f v dd v ctrl nc rf2 ctrl rf1 gnd ADG901 50 50 v dd test circuit 5. video feedthrough * similiar setups for adg902.
rev. a e8e ADG901/adg902 combiner rf source rf source spectrum analyzer 0.1 f v dd v ctrl gnd rf2 ctrl ADG901 rf1 50 50 v dd test circuit 6. ip 3 rf source v s spectrum analyzer 0.1 f v dd v ctrl gnd rf2 ctrl ADG901 rf1 50 50 v dd test circuit 7. p e1db
rev. a ADG901/adg902 e9e applications the ADG901/adg902 are ideal solutions for low power, high frequency applications. the low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. applications include switching between high frequency filters, ask generator, and fsk generator. absorptive vs. reflective switches the ADG901 is an absorptive (matched) switch with 50 termi- nated shunt legs, and the adg902 is a reflective switch with 0 terminated shunts to ground. the ADG901 absorptive switch has a good vswr on each port, regardless of the switch mode. an absorptive switch should be used when there is a need for a good vswr that is looking into the port but not passing the through signal to the common port. the ADG901 is therefore ideal for applications that require minimum reflections back to the rf source. it also ensures that the maximum power is trans- ferred to the load. the adg902 reflective switch is suitable for applications where high off port vswr does not matter and the switch has some other desired performance feature. it can be used in many appli- cations, including high speed filter selection. in most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. adg9xx evaluation board the adg9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. to prove that these devices meet user requirements, the user requires only a power supply and a network analyzer along with the evaluation board. an application note is available with the evaluation board and provides complete information on operating the evaluation board. the rf1 port (see figure 3) is connected through a 50 trans- mission line to the top left sma connector j1. rf2 is connected through a 50 transmission line to the top sma connector j2. j3 is connected to gnd. a through transmission line connects j4 and j5 and this transmission line is used to estimate the loss of the pcb over the environmental conditions being evaluated. the board is constructed of a 4-layer, fr4 material with a dielec- tric constant of 4.3 and an overall thickness of 0.062 inches. two ground layers with grounded planes provide ground for the rf transmission lines. the transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, clearance to ground plane of 0.030 inches, dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches. figure 3. adg9xx evaluation board top view
rev. a e10e ADG901/adg902 outline dimensions 8-lead mini small outline package [msop] (rm-8) dimensions shown in millimeters 0.80 0.60 0.40 8 0 85 4 1 4.90 bsc pin 1 0.65 bsc 3.00 bsc seating plane 0.15 0.00 0.38 0.22 1.10 max 3.00 bsc coplanarity 0.10 0.23 0.08 compliant to jedec standards mo-187aa 8-lead lead frame chip scale package [lfcsp] 3 mm 3 mm body (cp-8) dimensions shown in millimeters 1 bottom view 0.50 bsc 0.60 max pin 1 indicator 1.50 ref 0.50 0.40 0.30 0.25 min 0.45 2.75 bsc sq top view 12 max 0.80 max 0.65 typ seating plane pin 1 indicator 0.90 0.85 0.80 0.30 0.23 0.18 0.05 max 0.02 nom 0.20 ref 1.90 1.75 1.60 4 1.60 1.45 1.30 3.00 bsc sq 5 8
rev. a ADG901/adg902 e11e revision history location page 10/04?data sheet changed from rev. 0 to rev. a. changes to features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 changes to product highlights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 changes to specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 changes to ordering guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 change to adg9xx evaluation board section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 updated outline dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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